FRBP Kit & RAM Kit5 min read

by | Dec 17, 2012 | Press

Upsite Technologies Announces Two New HotLok® Sealing Solutions, Preventing Hot Air Re-circulation Inside Server Racks, Improving Cooling Capacity

HotLok Full Rack Blanking Panel (FRBP) Kit and HotLok Rack Airflow Management (RAM) Kit seal the largest ‘holes’ inside the server rack, creating a perimeter seal and improving overall cooling efficiency.

Albuquerque, NM (PRWEB) December 17, 2012 — Upsite Technologies®, Inc. is pleased to announce the new HotLok Full Rack Blanking Panel (FRBP) Kit and the Rack Airflow Management (RAM) Kit – the company’s latest, innovative, sealing solutions designed to prevent server exhaust re-circulation inside racks and enclosures.

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Cooling Capacity Factor (CCF) Reveals Data Center Savings

Learn the importance of calculating your computer room’s CCF by downloading our free Cooling Capacity Factor white paper.

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