You might not think it, but the small space between the bottom of an IT rack or cabinet and the raised floor or slab can play a profound role in airflow management and on IT inlet temperatures. Usually ranging in size from half an inch to two inches, this space allows the hot air from the IT equipment exhaust at the rear of a rack to travel underneath the rack and ultimately back into the IT equipment air inlets at the rack’s front. The recirculation of hot air can cause several problems for the data center: increases in IT inlet temperatures, hot spots, and likelihood of IT equipment failure in the long-term if the issue is not addressed.